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B43084F2826M
- Artikelnummer:
- B43084F2826M
- Hersteller:
- EPCOS
- Beschreibung:
- 82UF 250V 16X31.5 SINGLE END
- Bleifreier Status / RoHS Status:
- Bleifrei / RoHS-konform
- verfügbare Anzahl:
- 13370 Pieces
- Datenblatt:
- B43084F2826M.pdf
Einführung
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Spezifikation
| Serie: | B43084 |
|---|---|
| Andere Namen: | B43084F2826M000 |
| Feuchtigkeitsempfindlichkeitsstufe (MSL): | 1 (Unlimited) |
| Hersteller-Teilenummer: | B43084F2826M |
| Expanded Beschreibung: | Aluminum Capacitors |
| Beschreibung: | 82UF 250V 16X31.5 SINGLE END |
| Email: | [email protected] |
In Verbindung stehende Teile für B43084F2826M
| Image | Artikelnummer | Hersteller | Beschreibung | Aussicht |
|---|---|---|---|---|
 |
B43084F2226M | EPCOS (TDK) | 22UF 250V 12.5X20 SINGLE END | Anfrage |
|
B43084F2476M | EPCOS (TDK) | 47UF 250V 16X20 SINGLE END | Anfrage |
|
B43084A5106M | EPCOS (TDK) | 10UF 450V 12.5X20 SINGLE END | Anfrage |
|
B43084F2156M | EPCOS (TDK) | 15UF 250V 10X20 SINGLE END | Anfrage |
|
B43084A9155M | EPCOS (TDK) | 1.5UF 400V 10X12.5 SINGLE END | Anfrage |
|
B43084A9156M | EPCOS (TDK) | 15UF 400V 12.5X20 SINGLE END | Anfrage |
|
B43084B9105M | EPCOS (TDK) | 1UF 400V 10X12.5 SINGLE END | Anfrage |
|
B43084F2106M | EPCOS (TDK) | 10UF 250V 10X16 SINGLE END | Anfrage |
|
B43084A4685M | EPCOS (TDK) | 6.8UF 350V 10X16 SINGLE END | Anfrage |
|
B43084F2686M | EPCOS (TDK) | 68UF 250V 16X25 SINGLE END | Anfrage |
|
B43084F2685M | EPCOS (TDK) | 6.8UF 250V 10X12.5 SINGLE END | Anfrage |
|
B43084F2336M | EPCOS (TDK) | 33UF 250V 12.5X25 SINGLE END | Anfrage |
|
B43084A4336M | EPCOS (TDK) | 33UF 350V 16X20 SINGLE END | Anfrage |
|
B43084A2476M | EPCOS (TDK) | 47UF 200V 12.5X20 SINGLE END | Anfrage |
|
B43084A2686M | EPCOS (TDK) | 68UF 200V 12.5X25 SINGLE END | Anfrage |
|
B43084A9225M | EPCOS (TDK) | 2.2UF 400V 10X12.5 SINGLE END | Anfrage |
|
B43084A9476M | EPCOS (TDK) | 47UF 400V 16X31.5 SINGLE END | Anfrage |
|
B43084A5475M | EPCOS (TDK) | 4.7UF 450V 10X20 SINGLE END | Anfrage |
läst Nachrichten
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog