Kaufen GN1052CWA2-CHIP mit BYCHPS
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GN1052CWA2-CHIP
- Artikelnummer:
- GN1052CWA2-CHIP
- Hersteller:
- Semtech
- Beschreibung:
- IC TRANSIMPEDANCE AMP MODULE
- Bleifreier Status / RoHS Status:
- Bleifrei / RoHS-konform
- verfügbare Anzahl:
- 17953 Pieces
- Datenblatt:
- GN1052CWA2-CHIP.pdf
Einführung
BYCHIPS ist der Strumpfhändler für GN1052CWA2-CHIP, wir haben die Lagerbestände zum sofortigen Versand und auch zur Langzeitversorgung. Bitte senden Sie uns Ihren Kaufplan für GN1052CWA2-CHIP per E-Mail, wir geben Ihnen einen besten Preis nach Ihrem Plan.
Spezifikation
| Art: | Retimer |
|---|---|
| Supplier Device-Gehäuse: | Module |
| Serie: | - |
| Verpackung: | Tray - Waffle |
| Verpackung / Gehäuse: | Module |
| Feuchtigkeitsempfindlichkeitsstufe (MSL): | 1 (Unlimited) |
| Hersteller-Teilenummer: | GN1052CWA2-CHIP |
| Expanded Beschreibung: | Retimer IC Fiber Optics Module |
| Beschreibung: | IC TRANSIMPEDANCE AMP MODULE |
| Anwendungen: | Fiber Optics |
| Email: | [email protected] |
In Verbindung stehende Teile für GN1052CWA2-CHIP
| Image | Artikelnummer | Hersteller | Beschreibung | Aussicht |
|---|---|---|---|---|
 |
GN1055CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V 10/11.3GBPS | Anfrage |
|
GN1056CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V 10G LIN OC-192 | Anfrage |
 |
ADUM4190BRIZ | Analog Devices Inc. | IC AMPLIFIER ISOLATED 16-SOIC | Anfrage |
|
GN1052WA2-CHIP | Semtech Corporation | IC TRANSIMPEDANCE AMP MODULE | Anfrage |
 |
LTC6400IUD-14#TRPBF | Linear Technology | IC ADC DRIVER DIFF 2.4GHZ 16QFN | Anfrage |
|
GN1057CW-CHIP | Semtech Corporation | IC AMP TIA 3.3V AGC 10/11.3GBPS | Anfrage |
|
GN1058CW-CHIP | Semtech Corporation | IC AMP TIA 10G LIN AGC REV PIN | Anfrage |
|
LTC6404IUD-2#PBF | Linear Technology | IC AMP/DRIVER DIFF 16-QFN | Anfrage |
|
GN1052CW-CHIP | Semtech Corporation | IC TRANSIMPEDANCE AMP DIE | Anfrage |
 |
MAX9612AUB+ | Maxim Integrated | IC OP AMP/COMPAR 12BIT 10UMAX | Anfrage |
läst Nachrichten
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
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- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog